1. Because of the polycondensation reaction in the curing process of phenolic molding compound, water will condense and water will come from it. When w is heated and solidified, it must be pressurized, that is, the method of molding or laminating must be adopted.

2. In the molding process, the mold temperature has a great influence on its fluidity. Generally, when it exceeds, the fluidity will drop rapidly. The curing rate is slow, and a lot of heat will be released, so the phenomenon of uneven curing and overheating often occurs due to the internal heat is not easy to release.

3. Phenolic molding compounds usually need to be dried before molding, the drying temperature is 90 ~ 12 (TT, drying time is 60s).